At Auto Shanghai, Intel unveiled its second-generation AI-enhanced software-defined vehicle (SDV) SoC—the first multi-node chiplet architecture for the automotive industry. Designed for intelligent, connected vehicles, this breakthrough SoC delivers scalable performance, cutting-edge AI, and cost efficiency for automakers.
Intel also announced strategic partnerships with ModelBest and Black Sesame Technologies, accelerating innovation in AI-powered cockpits, ADAS, and energy-efficient vehicle computing.
Why Intel’s Chiplet Tech is Revolutionizing Automotive
The second-gen SDV SoC is a game-changer, offering:
- 10X AI performance boost for generative & multimodal AI
- 3X graphics power for immersive in-car experiences
- 12 camera lanes for enhanced image processing
- Scalable, cost-efficient design for faster time-to-market
New Collaborations Driving the Future of Mobility
ModelBest – Integrates on-device LLM with Intel’s SDV SoC, enabling offline AI voice control for smarter cockpits.
Black Sesame Technologies – Combines autonomous driving + cockpit AI into a single energy-efficient platform.
Jack Weast, Intel VP of Automotive, stated: “We’re redefining vehicle compute with chiplet flexibility and AI power—making software-defined cars a reality.”
The Road Ahead: Smarter, More Efficient Vehicles
Intel’s latest innovations empower automakers to deliver next-gen AI experiences while optimizing power and cost. From energy efficiency to immersive HMI, Intel is leading the software-defined vehicle revolution.
